Process Engineer, Multi-wire Sawing

Our client is a well-known semiconductor multinational manufacturing company from Germany. Currently looking for a Process Engineer to optimize Multi-wire sawing process with data.

JOB DESCRIPTION

• Develop, optimize, and control multi-wire saw slicing processes to meet production and
  quality targets
• Apply data-driven methodologies, including SPC, to monitor process stability and identify
  improvement opportunities
• Analyze large datasets using tools such as JMP (preferred), Minitab, or Excel to drive
  decision-making
• Monitor and improve cutting performance, including wire tension, slurry/abrasive usage,
  and feed rates
• Troubleshoot process issues such as wafer breakage, thickness variation (TTV),
  bow/warp, and surface defects
• Lead design of experiments (DOE) and statistical analysis to optimize process
  parameters
• Interpret Cp/Cpk, control charts, and drive process improvements based on data insights
• Collaborate with equipment engineers to ensure proper machine setup, calibration, and
  maintenance
• Work closely with QA/QC teams to ensure compliance with product specifications and
  standards
• Lead process qualification for new materials, wire types, or equipment upgrades
• Develop and maintain process documentation, SOPs, and work instructions
• Support production teams with technical guidance and training
• Participate in root cause analysis (RCA) and implement corrective/preventive actions
  (CAPA)